Web Inspection, Solar Panel & Semiconductors

Web Inspection

Materials produced in a continuous roll or sheet, such as paper, textiles, film, foil, plastics, metals, glass, or coatings, are best inspected by line scan cameras. Line scanning offers unlimited pixels in the in the direction of a web’s motion with zero smear even at high speeds, higher dynamic range, greater processing efficiency and much lower price/pixel.

WEB Applications

  • Find defects such as cracks, tears, knots, holes
  • Find colour variations
  • Guide a robot for cutting, trimming, or shaping
  • Read a barcode, 2D matrix code, or stamped characters
  • Perform a critical dimensional measurement
  • Communicate with 3rd party equipment such as robots, PLCs, HMIs, and remote storage

Machine Vision Tools

  • Pattern matching tools for locating and identifying parts or features for alignment
  • Edge tools for detecting the presence, absence, or position of features
  • Measurement tools for checking dimensional accuracy
  • Barcode (1D and 2D) readers for product identification and tracking
  • Print recognition (OCR) tools for product identification, tracking, and readability
  • Count tools for verifying the number of parts or features
  • Surface flaw tools for detecting scratches, cracks, and discoloration
  • Colour tools for verifying the amount and location of coloured elements.
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Solar Panel Inspection

Teledyne DALSA’s high resolution and high speed line scan and TDI camera find extensive use in solar panel manufacture. Micro crack inspection is crucial, because micro cracks can eventually cause an entire panel to shatter, causing damage to other panels and equipment, and necessitating an expensive shutdown of the line for clean up and repairs. Since micro cracks are difficult to impossible to detect with visible light, some systems use near-infrared (NIR) backlighting to expose these defects.

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NIR inspection finds cracks in solar wafers

Semiconductor Wafer Inspection

In semiconductor manufacturing, yield drives costs, so manufacturers inspect products at many points between bare wafers and packaged ICs, seeking to identify defects as soon as possible.

Teledyne DALSA’s Advanced CMOS cameras delivers multi-megapixel resolution and high frame rates for area scan inspection systems. And the incredible sensitivity of our TDI line scan cameras is crucial to the highest-performance wafer inspection systems in the world.

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Semiconductor Mask Inspection

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Semiconductor Wafer Inspection